CV

Education

• M.ScR. in Biomedical Artificial Intelligence, University of Edinburgh, 2024
• M.Phil. in Imaging and Interventional Radiology, Chinese University of Hong Kong, 2020
• B.Eng. in Biomedical Engineering, South China University of Technology, 2017

Work experience

• 2020 - 2023: Research Assistant, CU Lab of AI in Radiology (CLAIR), Chinese University of Hong Kong

Patent

• System and Method for Articular Cartilage Thickness Mapping and Lesion Quantification. (US patent)

Funding

• Patent Application Fund, The Chinese University of Hong Kong (2022).

Award

• Silver Medal, International Exhibition of Inventions Geneva (2022).

Scholarship

• The Keyuan Scholarship, South China University of Technology (2016).
• The Longsun Scholarship, South China University of Technology (2015).
• The Dow Scholarship, South China University of Technology (2014).